Next Edition of 360 Chipset: Jasper

With the new Falcon 65nm chips appearing in 360 consoles already, Mercury News has leaked plans for Microsoft to have a new motherboard ready for next Fall, code named Jasper. This motherboard will not only have the smaller die CPU, but also a 65nm graphics chip from ATI, and smaller memory chips. All this size reduction should (in theory) cool down the 360 even further, helping to alleviate the overheating issues that have plagued early versions of the console. Microsoft has stressed that their improved heatsink in Falcon consoles should eliminate overheating. They probably aren’t too happy this news leaked out, though, as some people will wait until next year to purchase their console, just to be on the safe side.